Title :
Quantitative analysis of feature pixels in the region of interest of ultrasound images for detection of thermal lesion induced by focused ultrasound
Author :
Chu-chu He ; Shou-bei Wang ; Jing-feng Bai ; Xiang Ji ; Ya-zhu Chen
Author_Institution :
Sch. of Biomed. Eng., Shanghai Jiao Tong Univ., Shanghai, China
fDate :
Oct. 30 2014-Nov. 2 2014
Abstract :
The appearance of hyperecho is clinically considered as an indicator of tissue necrosis for ultrasonography-guided high-intensity focused ultrasound (USgHIFU). Nevertheless, there is unobservable hyperechoic change in the absence of cavitation or boiling during sonication. A quantitative analysis that could identify post-sonication change in the ultrasound image is proposed for the detection of HIFU-induced thermal lesion. Before analysis, the acquired images are preprocessed for cancelling of sonication-induced interference, and a region of interest (ROI) is set to cover the focal spot. In the analysis, two parameters that quantify the changes in grayscale of feature pixels in the ROI are used to detect the thermal lesion induced in pork ex vivo. It´s found that both parameters can identify more true positives but fewer false negatives than visualizing hyperecho. This study demonstrates the analysis in combination with diagnostic ultrasound system can be used to predict thermal lesion during HIFU treatment.
Keywords :
biomedical ultrasonics; interference suppression; ultrasonic focusing; ultrasonic imaging; diagnostic ultrasound system; feature pixel grayscale; focal spot; hyperechoic change; post-sonication change; quantitative analysis; sonication-induced interference cancelling; thermal lesion detection; tissue necrosis; ultrasonography-guided high-intensity focused ultrasound; ultrasound images; Acoustic waves; Gray-scale; Lesions; Piezoelectricity; Statistical analysis; Thermal analysis; Ultrasonic imaging; Feature pixel; High-intensity focused ultrasound; Quantitative analysis; Thermal lesion;
Conference_Titel :
Piezoelectricity, Acoustic Waves, and Device Applications (SPAWDA), 2014 Symposium on
Conference_Location :
Beijing
Print_ISBN :
978-1-4799-6424-6
DOI :
10.1109/SPAWDA.2014.6998568