DocumentCode :
1784198
Title :
An active-compliant micro-stage based on EAP artificial muscles
Author :
Mutlu, Rahim ; Alici, Gursel ; Xingcan Xiang ; Weihua Li
Author_Institution :
Sch. of Mech., Mater. & Mechatron. Eng., Univ. of Wollongong, Wollongong, NSW, Australia
fYear :
2014
fDate :
8-11 July 2014
Firstpage :
611
Lastpage :
616
Abstract :
Electroactive Polymer actuators (EAPs), also known as EAP artificial muscles, offer a great potential for soft robotics. They are suitable for bio-inspired robotic applications due to their built-in actuation property within the mechanical body. In this paper, we report on a fully compliant micro-stage with built-in actuation. It has been fabricated as one piece inspired from twining structures in nature. We have employed a soft robotic modeling approach and finite element modeling to predict the mechanical output of the stage as a function of the input voltage. Experiments were conducted under a range of electrical inputs (0.25-1.00 V). For a given electrical stimulus, the compliant mechanism results in a linear motion in the middle of the active compliant mechanism, as expected. Experiments and simulation results are in good correlation. The active compliant mechanism can be used as a micro stage as well as an optical zoom mechanism for mobile phone cameras and similar devices.
Keywords :
electroactive polymer actuators; finite element analysis; micromanipulators; EAP artificial muscles; active-compliant microstage; bio-inspired robotic applications; biologically inspired soft robotic manipulators; built-in actuation; electrical stimulus; electroactive polymer actuators; finite element modeling; linear motion; mechanical body; mechanical output prediction; mobile phone cameras; optical zoom mechanism; soft robotic modeling approach; twining structures; voltage 0.25 V to 1.00 V; Actuators; Manufacturing processes; Mathematical model; Polymers; Robots; Solid modeling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Intelligent Mechatronics (AIM), 2014 IEEE/ASME International Conference on
Conference_Location :
Besacon
Type :
conf
DOI :
10.1109/AIM.2014.6878146
Filename :
6878146
Link To Document :
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