DocumentCode :
1784210
Title :
Surface acoustic wave propagation characteristics of ScAlN/diamond structure with buried electrode
Author :
Qiao-zhen Zhang ; Tao Han ; Wei-biao Wang ; Hashimoto, Ken-ya ; Jing Chen
Author_Institution :
Dept. of Electron. Inf. & Electr. Eng., Shanghai Jiao Tong Univ., Shanghai, China
fYear :
2014
fDate :
Oct. 30 2014-Nov. 2 2014
Firstpage :
271
Lastpage :
274
Abstract :
In this paper, a 3D Finite Element model (FEM) of a surface acoustic wave (SAW) resonator consists of a piezoelectric thin film ScAlN /diamond layered structure with buried interdigital electrodes (IDT) was performed and analyzed using commercial software COMSOL Multiphysics, FEM software. We have done investigation on SAW propagation characteristics on the layered structures for different thickness of ScAlN film and electrode as well as different electrode materials. Simulation results showed that the maximum electromechanical coupling factor Kmax2 achieved up to be 14.35% for Rayleigh mode and 10% for Sezawa mode, which is more than two times larger than the previous report (5.48%). This work is useful for design of SAW devices with wideband and high frequency.
Keywords :
III-V semiconductors; aluminium compounds; diamond; electromechanical effects; finite element analysis; piezoelectric thin films; scandium compounds; surface acoustic wave resonators; surface acoustic waves; wide band gap semiconductors; 3D finite element model; COMSOL multiphysics commercial software; FEM software; Rayleigh mode; SAW propagation; ScAlN-C; Sezawa mode; buried interdigital electrodes; electromechanical coupling factor; piezoelectric thin film layered structure; surface acoustic wave propagation characteristics; surface acoustic wave resonator; Diamonds; Electrodes; Materials; Resonant frequency; Surface acoustic wave devices; Surface acoustic waves; FEM; SAW; layered structure; propagation characteristics;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Piezoelectricity, Acoustic Waves, and Device Applications (SPAWDA), 2014 Symposium on
Conference_Location :
Beijing
Print_ISBN :
978-1-4799-6424-6
Type :
conf
DOI :
10.1109/SPAWDA.2014.6998578
Filename :
6998578
Link To Document :
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