DocumentCode
1785515
Title
Decomposition of equal/unequal length coupled interconnect step response with separate RC, LC, and RL behaviors
Author
Mehri, Milad ; Masoumi, Nasser
Author_Institution
Adv. VLSI Lab., Univ. of Tehran, Tehran, Iran
fYear
2014
fDate
20-22 May 2014
Firstpage
290
Lastpage
295
Abstract
In this paper a simple method is proposed to separate and extract the output response of two RLC coupled unequal/equal length interconnects, considering electromagnetic coupling with RC, LC, and RL behaviors. The wire is separated in three parts, including RC, RL, and LC mode of operation. The output response is a combination of these three parts. All the results are comprised with data extracted using W-Model of HSPICE. By the proposed results, the designer can understand that the wire response can be estimated by separate RC, RL, or LC lumped segment and define which part is significant in overall behavior. Also the unequal length wires are studied with scattering parameters. For printed circuit board wire dimensions, most of the traces have unequal length. For these wires the coupling parts are modeled by simple segmented model. We considered that the length and origin of the coupled wires varies. In these cases, when the Quasi-TEM approximation is no more valid, S-parameters should be employed for adjacent wires crosstalk and reflection estimation. We conclude that even for the frequency ranges of 15GHz the RLC segmentation model is accurate for interconnect in printed circuit board scale wiring.
Keywords
crosstalk; electromagnetic coupling; electromagnetic interference; printed circuit interconnections; HSPICE W-Model; LC operation mode; RC operation mode; RL operation mode; RLC coupled unequal interconnect; RLC equal length interconnect; S-parameters; adjacent wires crosstalk; coupled interconnect step response; electromagnetic coupling; electromagnetic wave reflection; lumped segment; output response; printed circuit board scale wiring interconnect; quasiTEM approximation; segmented model; Accuracy; Capacitance; Couplings; Integrated circuit interconnections; Mathematical model; Simulation; Wires; Crosstalk Noise Waveform; Inductive and Capacitive Coupling; Partially Coupled; VLSI Interconnect;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Engineering (ICEE), 2014 22nd Iranian Conference on
Conference_Location
Tehran
Type
conf
DOI
10.1109/IranianCEE.2014.6999550
Filename
6999550
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