• DocumentCode
    1786155
  • Title

    Porous silicon as an efficient local thermal isolation platform on the Si wafer in the temparature range 5–350k

  • Author

    Valalaki, K. ; Nassiopoulou, A.G.

  • Author_Institution
    NCSR “Demokritos”/INN, Athens, Greece
  • fYear
    2014
  • fDate
    7-9 July 2014
  • Firstpage
    61
  • Lastpage
    64
  • Abstract
    The thermal conductivity of highly porous Si was determined in the temperature range 5-350K. It was found that its temperature dependence is monotonic in the range 20-350K, while below 20K it shows a plateau-like behavior similar to that observed in amorphous materials. The low values of the thermal conductivity of the material in the whole temperature range studied, extended also to cryogenic temperatures, make porous Si an excellent local substrate for providing efficient thermal isolation on the Si wafer for the on-chip integration of heating and cooling devices.
  • Keywords
    cryogenic electronics; elemental semiconductors; semiconductor devices; silicon; thermal conductivity; Si; amorphous materials; cooling devices; cryogenic temperatures; heating devices; highly-porous silicon; local substrate; local thermal isolation platform; monotonic temperature dependence; on-chip integration; plateau-like behavior; silicon wafer; temperature 5 K to 350 K; thermal conductivity; Conductivity; Cryogenics; Heating; Silicon; Temperature distribution; Thermal conductivity; cryogenic temperatures; porous Si; thermal conductivity; thermal isolation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Low Temperature Electronics (WOLTE), 2014 11th International Workshop on
  • Conference_Location
    Grenoble
  • Type

    conf

  • DOI
    10.1109/WOLTE.2014.6881026
  • Filename
    6881026