Title :
Workload- and instruction-aware timing analysis - The missing link between technology and system-level resilience
Author :
Kleeberger, Veit B. ; Maier, Petra R. ; Schlichtmann, Ulf
Author_Institution :
Inst. for Electron. Design Autom., Tech. Univ. Munchen, Munich, Germany
Abstract :
In today´s design of resilient embedded systems, logic circuit components play a key role. Many possible design choices at the gate level, such as implementation architecture or synthesis constraints, are vital for the resilience of the entire system. Hence, EDA algorithms at this level have to support exposing technology characteristics (such as process variations or aging) for consideration on higher levels of abstraction. Similarly, key parameters from system level, such as workload or executed processor instructions, have to be considered at lower levels for accurate analysis of, e.g., degradation effects. Circuit-level timing analysis plays a key role in this context as it provides key metrics such as achievable frequency, available timing margins and timing violation vulnerabilities of the analyzed circuit. We present an enhanced static timing analysis which links technology-level effects to system-level and vice versa. Specifically, we discuss the accurate and efficient consideration of system workload and impact of executed instructions on circuit timing.
Keywords :
electronic design automation; embedded systems; integrated circuit reliability; logic circuits; network analysis; timing; EDA algorithms; circuit-level timing analysis; executed processor instructions; instruction-aware timing analysis; logic circuit components; resilient embedded systems; system-level resilience; timing margins; timing violation; workload processor instructions; workload-aware timing analysis; Aging; Algorithm design and analysis; Clocks; Delays; Reliability; Transistors; Aging; Instructions; Process Variations; Signal Probability; Timing Analysis; Workload;
Conference_Titel :
Design Automation Conference (DAC), 2014 51st ACM/EDAC/IEEE
Conference_Location :
San Francisco, CA
DOI :
10.1145/2593069.2596694