Title :
Reinforcement learning based self-adaptive voltage-swing adjustment of 2.5D I/Os for many-core microprocessor and memory communication
Author :
Huang Hantao ; Sai Manoj, P.D. ; Dongjun Xu ; Hao Yu ; Zhigang Hao
Author_Institution :
Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore, Singapore
Abstract :
A reinforcement learning based I/O management is developed for energy-efficient communication between many-core microprocessor and memory. Instead of transmitting data under a fixed large voltage-swing, an online reinforcement Q-learning algorithm is developed to perform a self-adaptive voltage-swing control of 2.5D through-silicon interposer (TSI) I/O circuits. Such a voltage-swing adjustment is formulated as a Markov decision process (MDP) problem solved by model-free reinforcement learning under constraints of both power budget and bit-error-rate (BER). Experimental results show that the adaptive 2.5D TSI I/Os designed in 65nm CMOS can achieve an average of 12.5mw I/O power, 4GHz bandwidth and 3.125pJ/bit energy efficiency for one channel under 10-6 BER, which has 18.89% power saving and 15.11% improvement of energy efficiency on average.
Keywords :
CMOS memory circuits; Markov processes; decision theory; energy conservation; learning (artificial intelligence); microprocessor chips; multiprocessing systems; three-dimensional integrated circuits; .5D through-silicon interposer; 2.5D I/Os; BER; CMOS; MDP; Markov decision process problem; TSI I/O circuits; bit-error-rate; efficiency 15.11 percent; energy-efficient communication; fixed large voltage-swing; many-core microprocessor; memory communication; model-free reinforcement learning; online reinforcement Q-learning algorithm; power 12.5 mW; power budget; reinforcement learning based I/O management; reinforcement learning based self-adaptive voltage-swing adjustment; self-adaptive voltage-swing control; size 65 nm; Adaptation models; Bit error rate; Noise; Receivers; Transmitters; Tuning; Voltage control;
Conference_Titel :
Computer-Aided Design (ICCAD), 2014 IEEE/ACM International Conference on
Conference_Location :
San Jose, CA
DOI :
10.1109/ICCAD.2014.7001356