DocumentCode :
1787697
Title :
PowerCool: Simulation of integrated microfluidic power generation in bright silicon MPSoCs
Author :
Sridhar, Arvind ; Sabry, Mohamed M. ; Ruch, Patrick ; Atienza, David ; Michel, Bruno
Author_Institution :
Embedded Syst. Lab. (ESL), EPFL, Lausanne, Swaziland
fYear :
2014
fDate :
2-6 Nov. 2014
Firstpage :
527
Lastpage :
534
Abstract :
Integrated microfluidic power generation and power delivery promises to be a disruptive packaging technology with the potential to combat dark silicon. It essentially consists of integrated microchannel-based electrochemical “flow cells” in a 2D/3D multiprocessor system-on-chip (MPSoC), that generate electricity to power up the entire or part of the chip, while also simultaneously acting as a high-efficiency microfluidic heat sink. Further development of this technology requires efficient modeling tools that would assess the efficacy of such solutions and help perform early-stage design space exploration. In this paper, we propose a compact mathematical model, called PowerCool, that performs electro-chemical modeling and simulation of integrated microfluidic power generation in MPSoCs. The accuracy of the model has been validated against fine-grained multiphysics simulations of flow cells in the COMSOL software that is unsuitable for EDA because of large simulation times. PowerCool model is demonstrated to be up to 425x times faster than COMSOL simulations while incurring a worst-case error of only 5%. Furthermore, the PowerCool model has been used to study and assess the efficacy of this technology for a test MPSoC.
Keywords :
integrated circuit modelling; integrated circuit packaging; microfluidics; multiprocessing systems; silicon; system-on-chip; COMSOL software; EDA; PowerCool model; Si; bright silicon MPSoC; compact mathematical model; electro-chemical modeling; fine-grained multiphysics simulation; integrated microfluidic power generation; Anodes; Cathodes; Electric potential; Equations; Mathematical model; Microchannels;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Computer-Aided Design (ICCAD), 2014 IEEE/ACM International Conference on
Conference_Location :
San Jose, CA
Type :
conf
DOI :
10.1109/ICCAD.2014.7001401
Filename :
7001401
Link To Document :
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