• DocumentCode
    1787835
  • Title

    Epitaxial CaF2/BaF2-on-Si layers and electronic properties of the interface with the substrate

  • Author

    Fedosenko, Evgeniy V. ; Akimov, Aleksey N. ; Klimov, Alexander E. ; Shumsky, Vladimir N. ; Erkov, Vladimir G. ; Suprun, Sergey P.

  • Author_Institution
    Rzhanov Inst. of Semicond. Phys., Novosibirsk, Russia
  • fYear
    2014
  • fDate
    June 30 2014-July 4 2014
  • Firstpage
    90
  • Lastpage
    94
  • Abstract
    Layers of CaF2 and BaF2 were grown on Si substrates using molecular beam epitaxy. X-ray photoelectron spectroscopy has shown that the interface in Si-BaF2 structure at 750°C is mainly formed with Si-Ba bonds. Metal-insulator structures have been formed, and capacitance-voltage characteristics (C-V and G-V characteristics) were measured at various test voltage frequencies. Despite of the high density of broken bonds at the interface (about 1014 cm-2), the density of electronic states calculated from C-V and G-V characteristics was about 1011 eV-1cm-2.
  • Keywords
    X-ray photoelectron spectra; barium compounds; bonds (chemical); calcium compounds; electronic density of states; epitaxial layers; interface structure; metal-insulator boundaries; molecular beam epitaxial growth; BaF2-Si; C-V characteristics; CaF2-Si; G-V characteristics; Si; X-ray photoelectron spectroscopy; broken bonds; capacitance-voltage characteristics; density of electronic states; electronic properties; epitaxial layers; metal-insulator structures; molecular beam epitaxy; temperature 750 degC; test voltage frequencies; Epitaxial growth; Frequency measurement; Silicon; Substrates; Temperature; Dielectric materials; Interfaces; Molecular Beam Epitaxy; Recrystallization; Semiconducting materials; Surface processes;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro/Nanotechnologies and Electron Devices (EDM), 2014 15th International Conference of Young Specialists on
  • Conference_Location
    Novosibirsk
  • ISSN
    2325-4173
  • Print_ISBN
    978-1-4799-4669-3
  • Type

    conf

  • DOI
    10.1109/EDM.2014.6882484
  • Filename
    6882484