DocumentCode :
1788800
Title :
Self-written waveguide technology with light-curable resin enabling easy optical interconnection
Author :
Mikami, Osamu
Author_Institution :
Sch. of Eng., Tokai Univ., Hiratsuka, Japan
fYear :
2014
fDate :
2-4 Sept. 2014
Firstpage :
16
Lastpage :
19
Abstract :
Optical interconnect technology has attracted much attention to solve the bottleneck of electric wiring. In order to achieve optical interconnect, several problems mainly concerning optical coupling between printed wiring board (PWB) and/or fibers. Self-Written Waveguide (SWW) method is a promising approach for solving these problems. The SWW method uses a light-curable resin and enables fabrication of an optical channel waveguide. This optical waveguide is formed like icicle from the end face of the optical fiber under irradiation with UV light. This technology inherently produces very high coupling efficiency between the fiber and fabricated waveguide core. We have extended this fiber-SWW technology into the Mask-Transfer Self-Written (Mask-SWW) method. This method involves contact exposure of UV-curable resin through a photomask, and enables mass production of “polymer optical pin” in two-dimensional array structure. Applying these technologies, several optical interconnect devices have been fabricated. In this talk, these technologies and recent works will be presented.
Keywords :
masks; optical arrays; optical fabrication; optical fibre couplers; optical interconnections; printed circuits; resins; Mask-SWW method; PWB; UV light irradiation; electric wiring; light-curable resin; mask-transfer self-written method; optical channel waveguide fabrication; optical coupling; optical fibers; optical interconnect technology; optical interconnection; photomask; polymer optical pin; printed wiring board; self-written waveguide technology; two-dimensional array; Integrated optics; Optical coupling; Optical device fabrication; Optical fibers; Optical interconnections; Resins; Optical interconnect; Plug-in; Self-written waveguide; UV-curable resin; V-groove; light-path conversion;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Photonics (ICP), 2014 IEEE 5th International Conference on
Conference_Location :
Kuala Lumpur
Type :
conf
DOI :
10.1109/ICP.2014.7002297
Filename :
7002297
Link To Document :
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