Gold nanoparticles/graphene oxide/polyaniline nanocomposites film as sensitive LSPR-based sensor for Pb(II) ions detection

Author

Nawi, Nurulain Md ; Abdullah, Saad ; Bakar, A. Ashrif A.

Author_Institution

Dept. of Electr., Electron. & Syst. Eng., Univ. Kebangsaan Malaysia (UKM), Bangi, Malaysia

fYear

2014

fDate

2-4 Sept. 2014

Firstpage

188

Lastpage

190

Abstract

A simple fabrication technique of heavy metal detection for environmental monitoring using localized surface plasmon resonance spectroscopy was developed based on the gold nanoparticles decorated graphene oxide-polyaniline nanocomposite (AuNPs/GO/PANI) film which was deposited onto indium-tin-oxide glass. The composites of graphene oxide and polyaniline dispersion was prepared by in situ polymerization of aniline in the presence of GO and incorporated onto gold nanoparticles using spin-coating technique. Morphology characterization of Au/GO/PANI using FESEM showed a wrinkled, rough surface of GO/PANI sheets layered on top of gold nanoparticles that have size ranges 40-50 nm. The lspr-based sensor AuNPs/GO/PANI nanocomposites have exhibited high sensitivity towards lead ions detection with detection limit for as low as 0.03 ppm.

Keywords

chemical sensors; conducting polymers; gold; graphene; lead; nanocomposites; nanoparticles; nanophotonics; optical sensors; polymerisation; rough surfaces; spin coating; surface plasmon resonance; thin films; Au-CO; FESEM; ITO; Pb; Pb(II) ions detection; detection limit; environmental monitoring; gold nanoparticles; graphene oxide; heavy metal detection; in situ polymerization; indium-tin-oxide glass; localized surface plasmon resonance spectroscopy; morphology characterization; nanocomposites film; polyaniline; sensitive LSPR-based sensor; size 40 nm to 50 nm; spin-coating technique; wrinkled rough surface; Gold; Graphene; Ions; Lead; Nanocomposites; Nanoparticles; gold nanoparticles; graphene oxide; polyaniline; polymerisation;

fLanguage

English

Publisher

ieee

Conference_Titel

Photonics (ICP), 2014 IEEE 5th International Conference on

Conference_Location

Kuala Lumpur

Type

conf

DOI

10.1109/ICP.2014.7002351

Filename

7002351