DocumentCode
1788940
Title
Performance of SAC-OCDMA codes for multipoint fiber vibration sensing
Author
Danjuma, Kuje ; Taiwo, Ambali ; Sahbudin, R.K.Z. ; Mokhtar, Makhfudzah ; Yaacob, M.H.
Author_Institution
Dept. of Comput. & Commun. Syst. Eng., UPM, Serdang, Malaysia
fYear
2014
fDate
2-4 Sept. 2014
Firstpage
247
Lastpage
249
Abstract
Performance of Spectral Amplitude Coding - Optical Code Division Multiple Access (SACOCDMA) based fiber vibration sensor multiplexing using Multi-Service (MS) code has been investigated. The aim of the setup was to implement a multipoint fiber vibration sensing with less complexity, efficient performance against multiple access interference (MAI) and phase induced intensity noise (PIIN) which degrade performances. Comparison was made of the three sensing points with other existing SAC codes such as the Khazani Syed (KS) code, Modified Congruence Code (MQC) and Optical Orthogonal Code (OOC) in terms of level of signal power received, fiber length supported and complexity of system implementation. MS code has advantage of better received power hence supported longer fiber length, flexibility in increasing the number of sensors, service differentiation and shorter code length. Moreover, it has some close chips which can be filtered using single FBG therefore reduces the cost and complexity in sensor multiplexing.
Keywords
code division multiplexing; codes; fibre optic sensors; optical noise; vibration measurement; Khazani Syed code; MAI; MQC; OOC; PIIN; SAC-OCDMA Codes; code length; fiber length; fiber vibration sensor multiplexing; modified congruence code; multiple access interference; multiservice code; optical code division multiple access; optical orthogonal code; phase-induced intensity noise; spectral amplitude coding; Bandwidth; Multiplexing; Optical fiber sensors; Optical fibers; Vibrations; Khazani Syed (KS) code; Multi-Service (MS) code; multiple access interference; multipoint sensing; vibration measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Photonics (ICP), 2014 IEEE 5th International Conference on
Conference_Location
Kuala Lumpur
Type
conf
DOI
10.1109/ICP.2014.7002369
Filename
7002369
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