• DocumentCode
    1790344
  • Title

    Pressure sensor positions on insole used for walking analysis

  • Author

    Kanitthika, K. ; Chan, Kheong Sann

  • Author_Institution
    Dept. of Electr. & Electron. Eng., Hankyong Nat. Univ., Anseong, South Korea
  • fYear
    2014
  • fDate
    22-25 June 2014
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    Nowadays, the application of gait analysis using shoe insole pressure sensors is increasing, and is available in laboratories or markets with respect to its application. The purpose of this study is to suggest the optimal position of the sensor for measuring the foot pressure by insole. The foot pressures were collected using the commercial pressure measurement system (Pedar-x, Novel, Germany). There are many helpful functions for fast and accurate pressure data collection and analysis with 99 sensors per each side of foot. Participated subjects were 11 healthy persons (6 men and 5 women). Subjects were measured the foot pressure data when walking on treadmill about 1 minute with the same speed at 3km/hour to observe the pressure distribution of the foot and the change of foot pressure during walking. The correlation coefficients between the positions of 99 sensors (each foot) and 11 subjects were found by using the Pearson´s correlation analysis. In the results, the highest correlation coefficient has been shown at the heel region. The 2nd has at the metatarsal region, the 3rd has at the toe and the finger line, and the 4th has at the outline of the barefoot.
  • Keywords
    footwear; gait analysis; pressure sensors; Pearson correlation analysis; correlation coefficients; foot pressures; gait analysis; pressure sensor positions; shoe insole pressure sensors; walking analysis; Atmospheric measurements; Correlation; Correlation coefficient; Foot; Footwear; Legged locomotion; Pressure measurement; anthropometrics; foot pressure; pressure sensor; shoe insole;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Consumer Electronics (ISCE 2014), The 18th IEEE International Symposium on
  • Conference_Location
    JeJu Island
  • Type

    conf

  • DOI
    10.1109/ISCE.2014.6884394
  • Filename
    6884394