Numerical Study of Overheat Fault in Copper Wire Caused by Bad Contact Base on Multi-physics Coupling

Author

Wen-bing Yang ; Shan-Jun Mo ; Dong Liang ; Fang-Jie Zhen

Author_Institution

Sch. of Eng., Sun Yat-sen Univ., Guangzhou, China

fYear

2014

fDate

25-26 Oct. 2014

Firstpage

400

Lastpage

405

Abstract

It is of great significance to study heating mechanism of bad contact wire since its high risk of fire. This is a problem of multi-physics coupling, which refer to electric and temperature field. A numerical coupling model is introduced in this paper to describe the overheat fault caused by bad contact in HPDE insulated copper wire base on COMSOL Multiphysics software. The heating effect on the fatigue fracture surface is taken into account, which is affected by the current density, contact area, contact resistance and thermal expansion coefficient, etc.

Keywords

copper; electrical contacts; fault diagnosis; heating; numerical analysis; polyethylene insulation; wires (electric); COMSOL Multiphysics software; HPDE insulated copper wire; bad contact wire; contact area; contact resistance; copper wire; current density; electric field; fatigue fracture surface; heating effect; heating mechanism; multiphysics coupling; numerical coupling model; overheat fault; temperature field; thermal expansion coefficient; Contacts; Copper; Heating; Surface cracks; Surface resistance; Temperature distribution; Wires; Bad contact; COMSOL Multiphysics; Copper wire; Multi-physics;

fLanguage

English

Publisher

ieee

Conference_Titel

Intelligent Computation Technology and Automation (ICICTA), 2014 7th International Conference on

Conference_Location

Changsha

Print_ISBN

978-1-4799-6635-6

Type

conf

DOI

10.1109/ICICTA.2014.103

Filename

7003566