• DocumentCode
    1791480
  • Title

    Evaluation of digital ternary stimuli for dynamic test of ΣΔ ADCs

  • Author

    Dubois, Matthieu ; Stratigopoulos, Haralampos-G ; Mir, Salvador ; Barragan, Manuel J.

  • Author_Institution
    TIMA, Univ. Grenoble Alpes, Grenoble, France
  • fYear
    2014
  • fDate
    6-8 Oct. 2014
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Validation of an embedded test technique in terms of its expected yield loss and test escape metrics is a key step before it can be deployed in high-volume manufacturing. However, performing this validation at the design stage usually demands extensive computational resources, which may render electrical simulations infeasible. In this paper, we propose a digital test technique for dynamic test of ΣΔ ADCs based on a digital ternary stimulus together with an advanced simulation framework for its validation. The proposed simulation strategy relies on a combination of transistor-level simulations, behavioural simulations, and statistical tools. To show the feasibility of our approach, we use the proposed validation framework to compare the ternary stimulus with a digital bitstream stimulus, as well as with a standard high-resolution analog sine-wave stimulus.
  • Keywords
    circuit testing; dynamic testing; embedded systems; sigma-delta modulation; ΣΔ ADCs; advanced simulation framework; behavioural simulations; digital bitstream stimulus; digital ternary stimuli evaluation; digital test technique; dynamic test; electrical simulations; embedded test technique; high-volume manufacturing; standard high-resolution analog sine-wave stimulus; statistical tools; test escape metrics; transistor-level simulations; yield loss; Computational modeling; Discrete Fourier transforms; Modulation; Monte Carlo methods; Noise; Semiconductor device modeling; System-on-chip;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Very Large Scale Integration (VLSI-SoC), 2014 22nd International Conference on
  • Conference_Location
    Playa del Carmen
  • Type

    conf

  • DOI
    10.1109/VLSI-SoC.2014.7004153
  • Filename
    7004153