• DocumentCode
    1791517
  • Title

    Backplane/FDA correlation-FDA replacing commercial backplanes for SoC ethernet electrical validation

  • Author

    Mendoza-Bonilla, Jesus-Andres ; Cortez-Ibarra, Alejandro ; Vega-Ochoa, Edgar-Andrei ; Rangel-Patino, Francisco ; Gore, Brandon

  • Author_Institution
    Intel Tecnol. de Mexico SA de CV, Zapopan, Mexico
  • fYear
    2014
  • fDate
    6-8 Oct. 2014
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Due to the time to market (TTM) pressures for System on Chip (SoC), improvements in validation methodology are needed to reduce the time to launch products. Current high speed links run hundreds of signals at Gigabit per second data rates over one or two connectors and tens of inches of backplane. Suitable connectors have to fulfill tight crosstalk, reflection, and attenuation specifications. Accurate connector measurements and models are critical to the successful design of the whole link. However, due to high pin count and interdependencies with the backplane environment connector characterization is still a challenging task. In this paper a new enhanced electrical validation testing methodology is presented, focusing on Ethernet post silicon validation over backplane. This paper shows that it is possible to obtain similar results (voltage and timing) using a frequency dependent attenuator (FDA) as using commercial backplane. The results were obtained at 2.5Gbps.
  • Keywords
    crosstalk; electric connectors; integrated circuit testing; local area networks; system-on-chip; Ethernet post silicon validation; FDA; SoC Ethernet electrical validation; TTM pressures; attenuation specifications; backplane environment connector characterization; backplane-FDA correlation-FDA; bit rate 2.5 Gbit/s; commercial backplanes; connector measurements; crosstalk; enhanced electrical validation testing methodology; frequency dependent attenuator; gigabit per second data rates; high pin count; high speed links; reflection specifications; system on chip; time to launch product reduction; time to market pressures; Backplanes; Connectors; Correlation; Receivers; System-on-chip; Testing; Timing; 2500BASE-X; FDA; Gigabit Ethernet; Microserver SoC; SERDES; backplane; system marginality validation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Very Large Scale Integration (VLSI-SoC), 2014 22nd International Conference on
  • Conference_Location
    Playa del Carmen
  • Type

    conf

  • DOI
    10.1109/VLSI-SoC.2014.7004190
  • Filename
    7004190