Title :
Power dissipation effects on 28nm FPGA-based System on Chips neutron sensitivity
Author :
Bruni, G. ; Rech, P. ; Tambara, L. ; Nazar, G.L. ; Kastensmidt, F.L. ; Reis, R. ; Paccagnell, A.
Author_Institution :
Dipt. di Eletron. e Inf., Padova Univ., Padua, Italy
Abstract :
Modern System on Chips (SoCs) and embedded electronic devices work at very high frequencies, which have the countermeasure of increasing the power dissipation and, consequently, the silicon die temperature. The presented radiation experiments on a 28nm FPGA-based SoC demonstrate that the temperature variation caused by a higher operating frequency affects the FPGA configuration memory cross section. An evaluation and discussion of the observed reliability dependence on power dissipation effects on practical application is also presented.
Keywords :
field programmable gate arrays; neutrons; sensitivity analysis; system-on-chip; FPGA configuration memory cross section; SoC; embedded electronic device; power dissipation effect; radiation experiment; silicon die temperature; size 28 nm; system on chip neutron sensitivity; Field programmable gate arrays; Heating; Ocean temperature; Power dissipation; System-on-chip; Temperature measurement; Temperature sensors; FPGa; Power Dissipation; Radiation Sensitivity; System On Chips; Temperature;
Conference_Titel :
Very Large Scale Integration (VLSI-SoC), 2014 22nd International Conference on
Conference_Location :
Playa del Carmen
DOI :
10.1109/VLSI-SoC.2014.7004195
