DocumentCode :
1792337
Title :
MIMO EWMA-CUSUM condition-based Statistical Process Control in Manufacturing Processes
Author :
Ou, Y.J. ; Hu, Jiankun ; Li, Xin ; Le, Tuan-Vu
Author_Institution :
Singapore Inst. of Manuf. Technol., Singapore, Singapore
fYear :
2014
fDate :
16-19 Sept. 2014
Firstpage :
1
Lastpage :
8
Abstract :
To meet the challenges of the big data age, an urgent requirement from diverse manufacturing industries is to develop a systematic time-variant methodology to make good use of the condition parameters to benefit more from the monitoring point of view. With condition-based Statistical Process Control (SPC), we develop a time-variant Exponentially Weighted Moving Average-Cumulative Sum (EWMA-CUSUM) anomaly detection mechanism which can monitor real-time multi-condition parameters, as well as multi-output quality characteristics simultaneously and efficiently. This technique enables the process user to conduct the visualization in real-time, thus, affording the representation of the information from huge volume of data. In order to demonstrate the implementation for the monitoring of a real manufacturing process, the Wire Electrochemical Tuning (WECT) process is adopted as a practical application. The proposed mechanism is superior to the conventional univariate charting mechanism by 18.75% in terms of detection accuracy and it has great potential to be employed in a large area of factorial applications.
Keywords :
condition monitoring; control charts; statistical process control; tuning; MIMO EWMA-CUSUM condition-based statistical process control; WECT process; anomaly detection mechanism; condition monitoring; exponentially weighted moving average-cumulative sum; manufacturing processes; time-variant methodology; wire electrochemical tuning process; Control charts; Manufacturing processes; Monitoring; Optimization; Process control; Sensitivity; Big data; Factory Technology; Incipient detection; Multi-input Multi-output (MIMO); Time-variant;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Emerging Technology and Factory Automation (ETFA), 2014 IEEE
Conference_Location :
Barcelona
Type :
conf
DOI :
10.1109/ETFA.2014.7005097
Filename :
7005097
Link To Document :
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