Title :
Connecting silicon photonic circuits to multi-core fibers by photonic wire bonding
Author :
Lindenmann, Nicole ; Dottermusch, Stephan ; Hoose, Tobias ; Billah, Muhammad ; Koeber, S. ; Freude, W. ; Koos, C.
Author_Institution :
Inst. of Photonics & Quantum Electron. (IPQ), Karlsruhe Inst. of Technol. (KIT), Karlsruhe, Germany
Abstract :
A four-core fiber is coupled to a silicon photonic chip by photonic wire bonding. The technique does not require active alignment and is well suited for automated fabrication. Measured coupling losses amount to 1.7 dB.
Keywords :
bonding processes; elemental semiconductors; integrated optics; optical fibre fabrication; optical fibre losses; silicon; Si; automated fabrication; coupling losses; loss 1.7 dB; multicore fibers; photonic wire bonding; silicon photonic circuits; Fabrication; Insertion loss; Loss measurement; Optical fiber couplers; Optical fiber devices; Photonics; Wires;
Conference_Titel :
Optical Interconnects Conference, 2014 IEEE
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4799-2467-7
DOI :
10.1109/OIC.2014.6886114
