Title :
LTB-3D conference committee
Abstract :
Provides a listing of current committee members and society officers.
Conference_Titel :
Low Temperature Bonding for 3D Integration (LTB-3D), 2014 4th IEEE International Workshop on
Conference_Location :
Tokyo, Japan
Print_ISBN :
978-1-4799-5260-1
DOI :
10.1109/LTB-3D.2014.6886138
