Title :
Brick-like based KGDs self-assembly and connection technologies for 3DIC integration
Author :
Yu-Cheng Fan ; Chih-Kang Lin ; Wei-Syuan Chen ; Yin-Te Hsieh
Author_Institution :
Dept. of Electron. Eng., Nat. Taipei Univ. of Technol., Taipei, Taiwan
Abstract :
In this paper, we proposed a brick-like based KGDs (known good die) self-assembly and connection technologies for 3DIC (three dimensional integrated circuit) integration. We solved the inflexible connection problem and achieved effectively 3DIC integration.
Keywords :
integrated circuit interconnections; self-assembly; three-dimensional integrated circuits; 3DIC integration; brick-like based KGDs self-assembly; connection technologies; known good die; three dimensional integrated circuit; Bonding; Integrated circuit interconnections; Logic gates; Metals; Self-assembly; Three-dimensional displays;
Conference_Titel :
Low Temperature Bonding for 3D Integration (LTB-3D), 2014 4th IEEE International Workshop on
Conference_Location :
Tokyo
Print_ISBN :
978-1-4799-5260-1
DOI :
10.1109/LTB-3D.2014.6886144
