• DocumentCode
    1792537
  • Title

    Brick-like based KGDs self-assembly and connection technologies for 3DIC integration

  • Author

    Yu-Cheng Fan ; Chih-Kang Lin ; Wei-Syuan Chen ; Yin-Te Hsieh

  • Author_Institution
    Dept. of Electron. Eng., Nat. Taipei Univ. of Technol., Taipei, Taiwan
  • fYear
    2014
  • fDate
    15-16 July 2014
  • Firstpage
    5
  • Lastpage
    5
  • Abstract
    In this paper, we proposed a brick-like based KGDs (known good die) self-assembly and connection technologies for 3DIC (three dimensional integrated circuit) integration. We solved the inflexible connection problem and achieved effectively 3DIC integration.
  • Keywords
    integrated circuit interconnections; self-assembly; three-dimensional integrated circuits; 3DIC integration; brick-like based KGDs self-assembly; connection technologies; known good die; three dimensional integrated circuit; Bonding; Integrated circuit interconnections; Logic gates; Metals; Self-assembly; Three-dimensional displays;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Low Temperature Bonding for 3D Integration (LTB-3D), 2014 4th IEEE International Workshop on
  • Conference_Location
    Tokyo
  • Print_ISBN
    978-1-4799-5260-1
  • Type

    conf

  • DOI
    10.1109/LTB-3D.2014.6886144
  • Filename
    6886144
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1792537