Title :
3D integration applications for low temperature direct bond technology
Author_Institution :
Ziptronix, Inc., Raleigh, NC, USA
Abstract :
This paper describes low temperature direct bond technology and applications enabled by this technology. This technology includes ZiBond® and DBI® hybrid bonding. Enabled applications include backside illuminated (BSI) image sensors; stacked BSI image sensors; DBI® hybrid bond image sensors; 3D memory; higher performance, lower cost RF front ends; and reduced thickness, lower cost die stacks with reduced stress.
Keywords :
cryogenic electronics; image sensors; integrated circuit bonding; three-dimensional integrated circuits; 3D integration applications; 3D memory; DBI hybrid bond image sensors; ZiBond-DBI hybrid bonding; backside illuminated image sensors; low temperature direct bond technology; lower cost RF front ends; lower cost die stacks; stacked BSI image sensors; Dielectrics; Image sensors; Metals; Radio frequency; Surface treatment; Temperature sensors; Three-dimensional displays;
Conference_Titel :
Low Temperature Bonding for 3D Integration (LTB-3D), 2014 4th IEEE International Workshop on
Conference_Location :
Tokyo
Print_ISBN :
978-1-4799-5260-1
DOI :
10.1109/LTB-3D.2014.6886147
