Title :
Carbon nanotube bump interconnect for flexible multilayer substrates
Author :
Fujino, Masahisa ; Terasaka, Haruo ; Suga, Takashi
Author_Institution :
Sch. of Eng., Univ. of Tokyo, Tokyo, Japan
Abstract :
Bump shaped Vertically Aligned Carbon Nanotubes as bump interconnect structures was fabricated and located on flexible substrates for flexible multilayer substrates. These structures were bonded and transferred by means of surface activated bonding method. In this paper, the fabrication process and electrical and mechanical properties of these structures is reported.
Keywords :
bending; carbon nanotubes; electrical resistivity; flexible electronics; integrated circuit interconnections; nanoelectronics; nanofabrication; sputter etching; three-dimensional integrated circuits; wafer bonding; C; bump shaped vertically aligned carbon nanotubes; carbon nanotube bump interconnect structures; electrical properties; fabrication process; flexible multilayer substrates; mechanical properties; surface activated bonding method; Bonding; Carbon nanotubes; Integrated circuit interconnections; Nonhomogeneous media; Substrates; Surface treatment;
Conference_Titel :
Low Temperature Bonding for 3D Integration (LTB-3D), 2014 4th IEEE International Workshop on
Conference_Location :
Tokyo
Print_ISBN :
978-1-4799-5260-1
DOI :
10.1109/LTB-3D.2014.6886162
