Room temperature bonding of electroplated Au patterns with atomically smooth surface prepared by a replication process using a sacrificial layer

Author

Kurashima, Yuichi ; Maeda, Atsushi ; Takagi, Hiroyuki

Author_Institution

Res. Center for Ubiquitous MEMS & Micro Eng. (UMEMSME), Nat. Inst. of Adv. Ind. Sci. & Technol. (AIST), Tsukuba, Japan

fYear

2014

fDate

15-16 July 2014

Firstpage

25

Lastpage

25

Abstract

We demonstrate a replication process of a surface shape from an atomically smooth master substrate onto electroplated Au patterns by a lift-off process using a thin sacrificial layer. An atomically smooth Au surface with a root mean square surface roughness of 0.8 nm could be created by the process. We also examined its applicability to room-temperature Au-Au bonding in air. A high bonding strength of about 250 MPa was obtained.

Keywords

bonding processes; electronics packaging; electroplated coatings; gold; micromechanical devices; surface roughness; Au; MEMS; atomically smooth surface; bonding strength; electroplated gold patterns; lift-off process; replication process; room temperature bonding; root mean square surface roughness; temperature 293 K to 298 K; thin sacrificial layer; Atomic layer deposition; Bonding; Gold; Rough surfaces; Silicon; Substrates; Surface roughness;

fLanguage

English

Publisher

ieee

Conference_Titel

Low Temperature Bonding for 3D Integration (LTB-3D), 2014 4th IEEE International Workshop on

Conference_Location

Tokyo

Print_ISBN

978-1-4799-5260-1

Type

conf

DOI

10.1109/LTB-3D.2014.6886164

Filename

6886164