Title :
Room temperature bonding of wafers in air using Au-Ag alloy films
Author :
Kon, Hiroyuki ; Uomoto, M. ; Shimatsu, T.
Author_Institution :
Frontier Res. Inst. for Interdiscipl. Sci. (FRIS), Tohoku Univ., Sendai, Japan
Abstract :
Room temperature bonding of wafers in air using Au-Ag alloy films was studied. Experimental results show that the bonding using Au-Ag alloy films containing Ag content up to 70-80 at% shows almost equal bonding performance in air to that obtained using Au films.
Keywords :
gold alloys; metallic thin films; silver alloys; three-dimensional integrated circuits; wafer bonding; Au-Ag alloy films; AuAg; room temperature wafer bonding; temperature 293 K to 298 K; Bonding; Films; Gold; Silicon; Substrates; Surface treatment;
Conference_Titel :
Low Temperature Bonding for 3D Integration (LTB-3D), 2014 4th IEEE International Workshop on
Conference_Location :
Tokyo
Print_ISBN :
978-1-4799-5260-1
DOI :
10.1109/LTB-3D.2014.6886167
