Fabrication of miniaturized polarization sensors using flip-chip bonding with atmospheric-pressure plasma activation

Author

Ikeda, Shoji ; Yamamoto, Manabu ; Higurashi, Eiji ; Suga, Takashi ; Oguchi, Toshiki

Author_Institution

Sch. of Eng., Univ. of Tokyo, Tokyo, Japan

fYear

2014

fDate

15-16 July 2014

Firstpage

36

Lastpage

36

Abstract

An ultra-small polarization sensor integrated with aluminum wire-grid polarizers has been developed for a compact optical rotary encoder. Flip-chip bonding using atmospheric-pressure plasma activation with mixed gas of Ar and H₂ at a relatively low bonding temperature of 150 °C was applied to fabricate the integrated sensors. The feasibility of rotational angle measurement of a linear polarizer was demonstrated using the fabricated sensors.

Keywords

aluminium; atmospheric pressure; flip-chip devices; lead bonding; nanosensors; nanowires; optical sensors; Al; aluminum nanowire-grid polarizers; atmospheric-pressure plasma activation; compact optical rotary encoder; flip-chip bonding; linear polarizer; miniaturized polarization sensor fabrication; rotational angle measurement; temperature 150 degC; ultra-small polarization sensor; Bonding; Optical sensors; Plasma temperature; Substrates; Temperature measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Low Temperature Bonding for 3D Integration (LTB-3D), 2014 4th IEEE International Workshop on

Conference_Location

Tokyo

Print_ISBN

978-1-4799-5260-1

Type

conf

DOI

10.1109/LTB-3D.2014.6886175

Filename

6886175