Title :
Microstructural change of Ag nanoporous bonding joint and interdiffusion of Cu / Ag during thermal aging
Author :
Min-Su Kim ; Nishikawa, Hisashi
Author_Institution :
Joining & Welding Res. Inst., Osaka Univ., Ibaraki, Japan
Abstract :
We proposed the low temperature solid state die-attach process using Ag nanoporous sheet for the high temperature power electronic packaging. The sound Cu/Cu joint can be achieved at 300 °C under nitrogen atmosphere through Ag nanoporous bonding method. In this study, the thermal stability of The Ag nanoporous bonding Cu/Cu joint and the interdiffusion behavior between Ag joining material and Cu substrate during thermal aging at 250 °C were investigated. The inserted Ag layer shows porous layer and this porous structure is gradually densified with extension of aging time. Kirkendall voids induced interdiffusion of Cu/Al are also identified.
Keywords :
ageing; aluminium; bonding processes; copper; electronics packaging; microassembling; nanoporous materials; silver; thermal stability; Cu-Ag; Cu-Al; Cu-Cu; Kirkendall voids; aging time; high temperature power electronic packaging; interdiffusion behavior; low temperature solid state die-attach process; nanoporous bonding joint; nanoporous sheet; nitrogen atmosphere; porous layer; porous structure; temperature 250 degC; temperature 300 degC; thermal aging; thermal stability; Aging; Bonding; Educational institutions; Joints; Materials; Packaging; Scanning electron microscopy;
Conference_Titel :
Low Temperature Bonding for 3D Integration (LTB-3D), 2014 4th IEEE International Workshop on
Conference_Location :
Tokyo
Print_ISBN :
978-1-4799-5260-1
DOI :
10.1109/LTB-3D.2014.6886181
