Title :
Room-temperature vacuum packaging using ultrasonic bonding with Cu compliant rim
Author :
Takigawa, Ryo ; Kawano, Hiroyuki ; Shuto, Takanori ; Ikeda, Akihiro ; Takao, Tomoaki ; Asano, Takashi
Author_Institution :
Grad. Sch. of Inf. Sci. & Electr. Eng., Kyushu Univ., Fukuoka, Japan
Abstract :
In this study, we demonstrate room-temperature vacuum sealing by combining Cu compliant rim with ultrasonic assist.
Keywords :
copper; integrated circuit bonding; integrated circuit interconnections; integrated circuit packaging; three-dimensional integrated circuits; ultrasonic bonding; Cu; copper compliant rim; copper interconnection; room-temperature vacuum packaging; temperature 293 K to 298 K; three-dimensional integrated circuits; ultrasonic bonding; Acoustics; Bonding; Films; Glass; Packaging; Scanning electron microscopy; Silicon;
Conference_Titel :
Low Temperature Bonding for 3D Integration (LTB-3D), 2014 4th IEEE International Workshop on
Conference_Location :
Tokyo
Print_ISBN :
978-1-4799-5260-1
DOI :
10.1109/LTB-3D.2014.6886183
