Title :
In-situ observation of ultrasonic bonding using high speed camera
Author :
Shuto, Takanori ; Asano, Takashi
Author_Institution :
Grad. Sch. of Inf. Sci. & Electr. Eng., Kyushu Univ., Fukuoka, Japan
Abstract :
Room-temperature microjoining in the air ambient has been achieved by using cone-shaped Au bump with ultrasonic application. In-situ observation of the ultrasonic bonding is performed using a high speed camera for the purpose of investigating dynamics of the bonding process. “Softening” of the bump under the application of ultrasonic is observed. It is suggested that bonding is almost completed within 100 ms.
Keywords :
cameras; gold alloys; ultrasonic bonding; Au; air ambient; bump softening; cone-shaped gold bump; high speed camera; in-situ observation; room-temperature microjoining; temperature 293 K to 298 K; time 100 ms; ultrasonic bonding process; Gold; Image resolution; Indium gallium arsenide;
Conference_Titel :
Low Temperature Bonding for 3D Integration (LTB-3D), 2014 4th IEEE International Workshop on
Conference_Location :
Tokyo
Print_ISBN :
978-1-4799-5260-1
DOI :
10.1109/LTB-3D.2014.6886184
