Title :
Nanoporous gold as a versatile bonding intermediate
Author :
Lin, Yu-Chen ; Wang, W.-S. ; Gessner, T. ; Esashi, Masayoshi
Author_Institution :
WPI-AIMR, Tohoku Univ., Sendai, Japan
Abstract :
On-chip nanoporous gold fabrication was developed with binary alloy deposition subsequently a dealloying process. Using this novel nanostructure as the bonding intermediate, nanoporous gold on one bonding substrate was boned to a thin gold film, that realized low temperature bonding, heterogeneous bonding, ultra thin film bonding and room temperature bonding.
Keywords :
bonding processes; gold; metallic thin films; nanofabrication; nanoporous materials; Au; binary alloy deposition; bonding intermediate; bonding substrate; dealloying process; heterogeneous bonding; low temperature bonding; on-chip nanoporous gold fabrication; room temperature bonding; temperature 293 K to 298 K; thin gold film; ultrathin film bonding; Bonding; Gold; Plasma temperature; Silicon; Substrates; Surface treatment;
Conference_Titel :
Low Temperature Bonding for 3D Integration (LTB-3D), 2014 4th IEEE International Workshop on
Conference_Location :
Tokyo
Print_ISBN :
978-1-4799-5260-1
DOI :
10.1109/LTB-3D.2014.6886185
