DocumentCode
1792642
Title
Solid Liquid Inter-Diffusion bonding at low temperature
Author
Froemel, J. ; Baum, Marcus ; Wiemer, M. ; Gessner, T.
Author_Institution
WPI-Adv. Inst. for Mater. Res., Tohoku Univ., Sendai, Japan
fYear
2014
fDate
15-16 July 2014
Firstpage
62
Lastpage
62
Abstract
Solid Liquid Inter-Diffusion (SLID) bonding using the systems Cu/Ga and Au/In have been investigated regarding the bonding parameters and their influence on shear strength. Especially temperature dependence and composition of interface have been focused on.
Keywords
chemical interdiffusion; copper; diffusion bonding; gallium; gold; indium; shear strength; wafer bonding; wafer level packaging; Au-In; Cu-Ga; bonding parameters; interface composition; shear strength; solid liquid interdiffusion bonding; temperature dependence; Bonding; Educational institutions; Gallium; Gold; Liquids; Temperature sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Low Temperature Bonding for 3D Integration (LTB-3D), 2014 4th IEEE International Workshop on
Conference_Location
Tokyo
Print_ISBN
978-1-4799-5260-1
Type
conf
DOI
10.1109/LTB-3D.2014.6886198
Filename
6886198
Link To Document