Direct bonding for dissimilar metals assisted by carboxylic acid vapor

Author

Shang-Kun Huang ; Chih-Hao Fan ; Chia Chen Kuo ; Jenn-Ming Song

Author_Institution

Dept. of Mater. Sci. & Eng., Nat. Chung Hsing Univ., Taichung, Taiwan

fYear

2014

fDate

15-16 July 2014

Firstpage

63

Lastpage

63

Abstract

A low-temperature low-vacuum direct bonding process for dissimilar metals via surface modification and activation with carboxylic acid vapors has been proposed in this study. Robust joints of Cu/Zn, Cu/Ag and Ni/Zn could be obtained subject to thermal compression at 300 °C. Such joints still possess a shear strength higher than 10 MPa when the testing temperature reaches 250°C. It has great potential for wide applications, especially when low process temperature as well as high operation temperature is desired.

Keywords

copper; lead bonding; nickel; organic compounds; shear strength; silver; surface treatment; three-dimensional integrated circuits; wafer bonding; zinc; Cu-Ag; Cu-Zn; Ni-Zn; carboxylic acid vapors; dissimilar metals; low-temperature low-vacuum direct bonding process; shear strength; surface modification; temperature 300 degC; thermal compression; Bonding; Joints; Nickel; Surface treatment; Zinc;

fLanguage

English

Publisher

ieee

Conference_Titel

Low Temperature Bonding for 3D Integration (LTB-3D), 2014 4th IEEE International Workshop on

Conference_Location

Tokyo

Print_ISBN

978-1-4799-5260-1

Type

conf

DOI

10.1109/LTB-3D.2014.6886199

Filename

6886199