DocumentCode
1793319
Title
Designing high-speed signal distribution for multi-drop connection using simulations
Author
Sayfan-Altman, Shai ; Vulfin, Vladimir ; Haridim, Motti
Author_Institution
ANSYS, Inc., Rishon Le Zion, Israel
fYear
2014
fDate
3-5 Dec. 2014
Firstpage
1
Lastpage
4
Abstract
Multi point distribution is used in many applications. Connection of multiple taps along the signal transmission line leads to impedance changes, and as a result the signal integrity may be degraded. This makes the design more challenging, especially in high speed circuits. Bus design layout that achieves both impedance matching and uniform power distribution for a multi-drop bus has been recently proposed. These designs are mostly based on resistor impedance matching for each branch. In most designs the signal´s spectrum is not taken into account when designing multidrop interconnects, and hence the input impedance may not be optimal for the working frequencies. In this paper, we present a scheme that is based on changing the line impedance of each segment of the bus, hence removing the need to add resistors in the layout. We also propose a design method to achieve constant impedance along the transmission line, using information derived from the signal spectrum. The simulation results of circuit boards design demonstrate good agreement with the theoretical results, and show reliable performance at high bit rates.
Keywords
high-speed integrated circuits; impedance matching; integrated circuit interconnections; printed circuit design; circuit boards design; constant impedance; high-speed signal distribution; line impedance; multidrop bus; multidrop connection; multidrop interconnects; multiple taps; multipoint distribution; resistor impedance matching; signal integrity; signal spectrum; signal transmission line; uniform power distribution; Clocks; Impedance; Impedance matching; Layout; Optimization; Reflection; Resistors; clock distribution; high speed; signal integrity;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical & Electronics Engineers in Israel (IEEEI), 2014 IEEE 28th Convention of
Conference_Location
Eilat
Print_ISBN
978-1-4799-5987-7
Type
conf
DOI
10.1109/EEEI.2014.7005788
Filename
7005788
Link To Document