• DocumentCode
    1793447
  • Title

    Integrated high-voltage (HV) Schottky diode for power management ICs

  • Author

    Mistele, D. ; Berkovitch, N. ; Levin, S. ; Shapira, Shye

  • Author_Institution
    R&D Power Manage., TowerJazz Semicond., Migdal Ha´Emek, Israel
  • fYear
    2014
  • fDate
    3-5 Dec. 2014
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    A novel high-voltage Schottky diode is presented, which allows implementation into Silicon-based power management integrated circuits. The Schottky diode has strongly reduced leakage current at reverse bias and improved forward current under forward bias. Compared to a previous design, the forward resistance at +0.4V is reduced twofold, and at the same time, leakage current in reverse at -25V is reduced by a factor of 30 along with a smaller temperature dependency. The breakdown voltage (BV) of the device is typically >45V in reverse mode. The main element of the novel design is the application of p/n-junctions in parallel to the Schottky metal contact. Further, in forward mode under current surge conditions, the p/n-junctions protect the Schottky diode.
  • Keywords
    Schottky barriers; Schottky diodes; integrated circuit design; p-n junctions; power integrated circuits; Schottky metal contact; breakdown voltage; current surge conditions; forward current; forward mode; integrated high-voltage Schottky diode; leakage current; p-n-junctions; power management IC; silicon-based power management integrated circuits; temperature dependency; voltage -25 V; Anodes; Junctions; Leakage currents; Schottky diodes; Temperature dependence; Temperature measurement; Tin; High Voltage; PMIC; Power Management Integrated Circuit; QRR; Schottky Diode; Schottky barrier height SBH; Switching losses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical & Electronics Engineers in Israel (IEEEI), 2014 IEEE 28th Convention of
  • Conference_Location
    Eilat
  • Print_ISBN
    978-1-4799-5987-7
  • Type

    conf

  • DOI
    10.1109/EEEI.2014.7005851
  • Filename
    7005851