DocumentCode
1793882
Title
Design of electrostatic adhesion device using the flexible electrodes
Author
Takada, Akifumi ; Nakamura, Shigenari ; Yamanishi, Yoko ; Hashimura, Shinji ; Nagasawa, S. ; Kogure, Takanobu ; Maeda, Shigenobu
fYear
2014
fDate
10-12 Nov. 2014
Firstpage
1
Lastpage
4
Abstract
This paper presents a fabrication method of electrostatic adhesion device using flexible electrodes. When an electric charge is stored in the bipolar plate of a capacitor, an electrostatic force acts. We perform adhesion to a wall surface using this electrostatic force. Using the electrostatic force, electrostatic adhesion force is controlled by the electricity. The flexible electrodes are created by spraying a solution containing dispersed carbon black onto a silicon rubber. Flexibility of the device can avoid damage to its own and adapt to a variety of wall surface shapes. In experiments, two kinds of device surface structures were created. One is just flat and the other is pillar arrays. The pillar arrays structure was adopted from the viewpoint of biomimetic. Electrostatic adhesion force of these structures was measured with shear and tensile testing machines.
Keywords
adhesion; capacitors; electric charge; electrodes; plates (structures); silicone rubber; surface structure; biomimetic; bipolar plate; capacitor; damage avoidance; device surface structures; dispersed carbon black; electric charge; electricity control; electrostatic adhesion force device design; fabrication method; flexible electrodes; pillar array structure; shear testing machines; silicon rubber; tensile testing machines; wall surface shape; Adhesives; Electrodes; Electrostatics; Force; Partial discharges; Rough surfaces; Surface roughness;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro-NanoMechatronics and Human Science (MHS), 2014 International Symposium on
Conference_Location
Nagoya
Print_ISBN
978-1-4799-6678-3
Type
conf
DOI
10.1109/MHS.2014.7006081
Filename
7006081
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