DocumentCode
1793908
Title
2D optoelectronic engines with wafer scale self-aligned optical cores
Author
Mathai, Sagi ; Rosenberg, Paul ; Sorin, Wayne ; Straznicky, Joseph ; Kiyama, Lennie ; Mack, Wayne ; Panotopoulos, Georgios ; Culler, Jason ; Devenport, Kent ; Tan, Min
Author_Institution
Hewlett-Packard Co., Palo Alto, CA, USA
fYear
2014
fDate
9-13 March 2014
Firstpage
1
Lastpage
3
Abstract
We developed a novel 24 channel (2×12) surface mount solder reflowable optoelectronic engine using MEMS manufacturing techniques, wafer scale packaging, and passive alignment. A fiber optic link operating at 16.5 Gbps/channel was demonstrated.
Keywords
integrated optoelectronics; microfabrication; micromechanical devices; optical fibre communication; surface mount technology; wafer level packaging; 2D optoelectronic engines; MEMS manufacturing; bit rate 16.5 Gbit/s; fiber optic link; passive alignment; surface mount solder reflowable optoelectronic engine; wafer scale packaging; wafer scale self-aligned optical cores; Engines; Integrated optics; Optical device fabrication; Optical diffraction; Optical fibers; Vertical cavity surface emitting lasers;
fLanguage
English
Publisher
ieee
Conference_Titel
Optical Fiber Communications Conference and Exhibition (OFC), 2014
Conference_Location
San Francisco, CA
Print_ISBN
978-1-5575-2994-7
Type
conf
DOI
10.1364/OFC.2014.Th4J.2
Filename
6886864
Link To Document