Author :
De Dobbelaere, P. ; Ayazi, A. ; Chi, Y. ; Dahl, A. ; Denton, S. ; Gloeckner, S. ; Kam-Yan Hon ; Hovey, S. ; Liang, Yun ; Mack, M. ; Masini, G. ; Mekis, A. ; Peterson, M. ; Pinguet, T. ; Schramm, J. ; Sharp, M. ; Sohn, C. ; Stechschulte, K. ; Sun, P. ; Vas
Author_Institution :
Luxtera Inc., Carlsbad, CA, USA
Abstract :
We address the effects of packaging on performance, reliability and cost of photonic devices. For silicon photonics we address some specific packaging aspects. Finally we propose an approach for integration of photonics and ASICs.
Keywords :
application specific integrated circuits; elemental semiconductors; integrated optics; packaging; reliability; silicon; ASIC; Si; cost; integration; packaging; performance; photonic devices; reliability; silicon photonics systems; Assembly; Integrated optics; Optical fiber couplers; Optical fiber dispersion; Photonics; Silicon;
