Title :
Taking optics to the chip: From board-mounted optical assemblies to chip-level optical interconnects
Author :
Schmidtke, Katharine ; Flens, Frank ; Mahgarefteh, Daniel
Author_Institution :
Finisar Corp., Sunnyvale, CA, USA
Abstract :
Board-mounted optical assemblies (BOAs) enable significant bandwidth density increase relative to pluggable optics at the card edge. We discuss the challenges for the next step in this evolution as optics moves towards the chip.
Keywords :
integrated optoelectronics; microprocessor chips; optical interconnections; BOA; board-mounted optical assemblies; chip-level optical interconnects; pluggable optics; Assembly; Bandwidth; High-speed optical techniques; Optical fibers; Optical interconnections;
Conference_Titel :
Optical Fiber Communications Conference and Exhibition (OFC), 2014
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-5575-2994-7
DOI :
10.1364/OFC.2014.W4I.1
