Title :
Heat dissipation based on LTCC-HTCC heterostructure
Author :
Jurcisin, Michal ; Slosarcik, Stanislav ; Kardos, Slavomir
Author_Institution :
Dept. of Technol. in Electron., Tech. Univ. of Kosice, Kośice, Slovakia
Abstract :
Articles deals with technology of realization of LTCC-HTCC heterostructure based on different thermal conductivity of substrates as well as with fabrication process of inner channels on the interface of heterostructure. In the practical part the results of measurements on realized samples for the purpose of use in field of heat dissipation from electronic microstructures are presented.
Keywords :
ceramic packaging; cooling; thermal conductivity; LTCC-HTCC heterostructure; electronic microstructures; heat dissipation; thermal conductivity; Cavity resonators; Conductivity; Cooling; Heating; Substrates; Thermal conductivity; Three-dimensional displays;
Conference_Titel :
Electronics Technology (ISSE), Proceedings of the 2014 37th International Spring Seminar on
Conference_Location :
Dresden
DOI :
10.1109/ISSE.2014.6887552
