DocumentCode :
1794776
Title :
LTCC lamination process using PMMA fugitive material
Author :
Toskov, Sasa ; Krcic, Nenad ; Radosavljevic, G.
Author_Institution :
Inst. of Sensor & Actuator Syst., Vienna Univ. of Technol., Vienna, Austria
fYear :
2014
fDate :
7-11 May 2014
Firstpage :
21
Lastpage :
26
Abstract :
Integrated cavities, screen-printed passive components and channels are common parts of 3D micro-fluidic devices fabricated in low temperature co-fired ceramics (LTCC) technology. However, realization of defect-free structures without cracks, sagging of cavities or channels is challenging and strongly influenced by quality of lamination and firing processing conditions. Lamination technique based on incorporation of polymethylmethycrylate (PMMA) sacrificial volume material (SVM) for implementation of large cavities inside LTCC module is presented in this paper. Optimized firing conditions for proper burnout of SVM have been described. Influence of lamination and firing processing conditions are demonstrated in fabrication of 3-dimensional micro-fluidic device. Tested structure contains screen printed interdigital capacitor (IDC) positioned inside large cavity with dimensions 0.23 +/- 0.01 × 5.6 × 11.2 [mm3] for thickness, width and length, respectively. Obtained results show advantages of PMMA incorporation in fabrication of defect-free structures in LTCC technology.
Keywords :
ceramics; firing (materials); laminations; microfluidics; polymers; sintering; 3D microfluidic devices; LTCC lamination process; PMMA fugitive material; PMMA sacrificial volume material; firing processing; integrated cavities; low temperature co-fired ceramics technology; screen printed interdigital capacitor; screen-printed passive components; Cavity resonators; Delamination; Lamination; Materials; Powders; Support vector machines; Three-dimensional displays;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Technology (ISSE), Proceedings of the 2014 37th International Spring Seminar on
Conference_Location :
Dresden
Type :
conf
DOI :
10.1109/ISSE.2014.6887555
Filename :
6887555
Link To Document :
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