Title :
Reactive paste for reflow soldering of large components
Author :
Seehase, D. ; Huth, Heiko ; Neiser, Arne ; Nowottnick, M.
Author_Institution :
Inst. of Electron. Appliances & Circuits, Univ. of Rostock, Rostock, Germany
Abstract :
For the energetic support of reflow soldering an exothermic reacting paste has been developed. This paste is applied on electronic assemblies adjacent to solder paste deposits before reflow soldering. During the reflow process a chemical reaction inside the paste is releasing energy in the form of heat. This heat is assisting in melting up the solder paste depots, hence allowing the processing of large components at lower peak temperatures. Such created solder joints are analyzed here towards their reliability. Also two examples of employing the reacting paste to aid in the soldering process of large components are given.
Keywords :
heating; melting; reflow soldering; electronic assembly; exothermic reacting paste; large component; reactive paste; reflow soldering; solder paste depot melting; surface mount technology; Heating; Materials; Reflow soldering; Resistors; Temperature measurement;
Conference_Titel :
Electronics Technology (ISSE), Proceedings of the 2014 37th International Spring Seminar on
Conference_Location :
Dresden
DOI :
10.1109/ISSE.2014.6887556
