DocumentCode :
1794782
Title :
Analysis of mechanical properties of LTCC substrates
Author :
Lukacs, Peter ; Pietrikova, Alena ; Livovsky, Lubomir
Author_Institution :
Dept. of Technol. in Electron., Tech. Univ. of Kosice, Kosice, Slovakia
fYear :
2014
fDate :
7-11 May 2014
Firstpage :
39
Lastpage :
43
Abstract :
In this paper we describe the most commonly used methods for analysis the mechanical properties of 3 types LTCC substrates (DuPont 951, DuPont 9K7, MuRata) based on three- and four-point bending as well as Dynamic Mechanical Analysis (DMA). The results of analysis show that the four-point bend test indicates a distribution of stress in the substrate with more accuracy and points to the tendency of the fracture-toughness state in the material. The three-point bend test achieves higher flexural strength of tested substrates. The re-firing process applied to the LTCC type 951 increases the flexural strength by 10 %. Extension of the duration of the firing process from 4 h to 26.5 h causes increasing the flexural strength by 100 %. This work proves that the Murata has the best homogeneity and the LTCC type 9K7 has the greatest predisposition to brittle fracture at a distance of lower supports of 32 mm. The sintering process´ conditions of the ceramics have the significant influence to the shrinkage of the all tested ceramics´ types. DMA analyses of the ceramics within the elasticity range confirm the described behavior of fracture-toughness state realized by classic test methods.
Keywords :
bending; bending strength; brittle fracture; ceramics; elasticity; firing (materials); fracture toughness; shrinkage; sintering; stress-strain relations; substrates; DuPont 951; DuPont 9K7; LTCC substrates; MuRata; brittle fracture; dynamic mechanical analysis; elasticity; firing process; flexural strength; four-point bending; fracture-toughness state; mechanical properties; shrinkage; sintering; three-point bending; time 4 h to 26.5 h; Ceramics; Firing; Microwave filters; Stress; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Technology (ISSE), Proceedings of the 2014 37th International Spring Seminar on
Conference_Location :
Dresden
Type :
conf
DOI :
10.1109/ISSE.2014.6887558
Filename :
6887558
Link To Document :
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