Title :
Thermal influences on IC packages during manual soldering process
Author :
Fodor, Alexandra ; Jano, Rajmond ; Pitica, D.
Author_Institution :
Appl. Electron. Dept., Tech. Univ. of Cluj-Napoca, Cluj-Napoca, Romania
Abstract :
The presented work investigates the manual soldering process and how the thermal phenomena can affect different ICs, depending on their form. The study was developed mainly for surface-mount devices because the assembling technique involves direct contact with the soldering iron. Simulations were carried out using SolidWorks Flow Simulation tool, following that practical experiment using a thermal camera to be done in order to understand exactly the process of manual soldering.
Keywords :
assembling; integrated circuit packaging; soldering; surface mount technology; thermal management (packaging); IC packages; SolidWorks flow simulation tool; assembling technique; direct contact; manual soldering process; soldering iron; surface-mount devices; thermal camera; thermal phenomena; Cameras; Iron; Manuals; Soldering; Solid modeling; Temperature distribution; Temperature measurement;
Conference_Titel :
Electronics Technology (ISSE), Proceedings of the 2014 37th International Spring Seminar on
Conference_Location :
Dresden
DOI :
10.1109/ISSE.2014.6887562
