Study of thermomechanical properties of one- and two-component conductive adhesives

The goal of this work was to find if there is some difference in thermomechanical properties of one- and two-component electrically conductive adhesives. All adhesive used in this study were of an epoxy type filled with silver flakes and all had isotropic electrical conductivity. The storage modulus, loss modulus and tan delta were studied using thermodynamic mechanical analysis carried out by a penetration probe. The samples were formed on glass substrates, the thermodynamic analysis was carried out by the force 0.3 ±0.2 N at 1Hz, the maximum temperature was 140 °C. It was found that there are no significant differences between the thermodynamic parameters of adhesives tested. It was also found that all adhesives were not optimally cured though curing was carried out in accordance with recommendation of a producer of adhesives.