Title :
Packaging technologies for (Ultra-)thin sensor applications in active magnetic bearings
Author :
Ernst, Damien ; Melzer, Michael ; Makarov, Denis ; Bahr, F. ; Hofmann, W. ; Schmidt, Oliver G. ; Zerna, Thomas
Author_Institution :
Centre of Microtechnical Manuf., Tech. Univ. Dresden, Dresden, Germany
Abstract :
We realized ultra-thin and flexible magnetic field sensors based on the Hall Effect in 2 μm thick Bismuth films prepared on commercial flexible double-layer polyimide PCB with a total thickness of 150 μm. These sensors could be potentially applied in active magnetic bearing (AMB) systems. Therefore, here we address reliability aspects of flexible Hall sensors with emphasis on the proper choice of adhesive to mount the sensor to a stator of the AMB. The thermal shock tests in the standard automotive temperature range of -40°C to 165°C as well as the vibration test of the sensor mounted to the stator has proven the sensor´s stability.
Keywords :
Hall effect transducers; bismuth; circuit reliability; electronics packaging; flexible electronics; magnetic bearings; magnetic field measurement; magnetic sensors; polymer films; printed circuits; stators; thermal shock; thin film sensors; AMB; Bi; active magnetic bearing; adhesive; bismuth film; flexible Hall sensor effect; flexible double-layer polyimide PCB; packaging technology; reliability; size 150 mum; size 2 mum; stator; temperature -40 degC to 165 degC; thermal shock testing; ultrathin flexible magnetic field sensor; vibration testing; Bismuth; Electric shock; Polyimides; Reliability; Stators; Temperature sensors; Vibrations;
Conference_Titel :
Electronics Technology (ISSE), Proceedings of the 2014 37th International Spring Seminar on
Conference_Location :
Dresden
DOI :
10.1109/ISSE.2014.6887577