Evaluation of long time stability of solder joints on Ag thick film conductors on Al2O3

Author

Gierth, Paul ; Zieschank, Michael ; Rebenklau, Lars

Author_Institution

Fraunhofer Inst. for Ceramic Technol. & Syst. IKTS, Dresden, Germany

fYear

2014

fDate

7-11 May 2014

Firstpage

137

Lastpage

142

Abstract

The long time stability of solder joints on Ag-based thick film pastes has been studied. Therefore shear strength, electrical resistance, temperature coefficient of resistance (TCR), optical inspections of solder surface and cross section analyses have been performed. Samples of 1206 and 0805 SMD-components mounted with SnAgCu, SnPbAg, SnBi and SnCu on Ag/Pd or Ag/Pt conductors were prepared. To detect the influence of intermetallic phase growth, high temperature storage according JESD22-A103C at 150°C (125°C for SnBi-solder) up to 500 h has been applied. Shear fatigue life of the interconnection joints was studied with temperature cycling according JESD22-A104D between +125°C/-40°C for up to 1000 cycles. Differences in shear fatigue and electrical characteristics will be evaluated and discussed.

Keywords

ageing; bismuth alloys; copper alloys; electric resistance; fatigue; lead alloys; palladium alloys; platinum alloys; silver alloys; solders; surface mount technology; tin alloys; Ag-Pd; Ag-Pt; Al₂O₃; JESD22-A103C; SMD component; SnAgCu; SnBi; SnCu; SnPbAg; cross section analysis; electrical resistance; interconnection joints; intermetallic phase growth; shear fatigue life; shear strength; solder joint long time stability; solder surface optical inspections; temperature coefficient of resistance; thick film conductor; thick film paste; Force; Intermetallic; Isothermal processes; Resistance; Soldering; Thick films;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Technology (ISSE), Proceedings of the 2014 37th International Spring Seminar on

Conference_Location

Dresden

Type

conf

DOI

10.1109/ISSE.2014.6887580

Filename

6887580