Influence of reflow soldering profiles on creation of IMC at the interface of SnBi/Cu

Author

Hirman, Martin ; Rendl, Karel ; Steiner, Frantisek ; Wirth, Vaclav

Author_Institution

Dept. of Technol. & Meas., Univ. of West Bohemia, Pilsen, Czech Republic

fYear

2014

fDate

7-11 May 2014

Firstpage

147

Lastpage

151

Abstract

The paper describes the effect of the solder profile on the formation of an intermetallic layer in the solder composition of 57.6% Bi-42% Sn-0.4% Ag. Soldered joints were made by soldering of chip resistors of 1206 size with different soldering reflow profiles. Solder pads on the PCB are made of copper therefore they mainly make Cu₆Sn₅ IMC. This layer has an effect on the mechanical strength of the soldered joint. Samples are measured by using the shear strength test. The thickness of the IMC layer is measured by Confocal Laser Scanning Microscope. IMC layer thickness grows with greater delivered energy into the joint during soldering.

Keywords

bismuth alloys; copper alloys; printed circuits; reflow soldering; shear strength; tin alloys; BiSnAg; Cu₆Sn₅; IMC; PCB; SnBi-Cu; chip resistors; confocal laser scanning microscope; intermetallic compound; mechanical strength; printed circuit boards; reflow soldering profiles; shear strength test; solder pads; Heating; Intermetallic; Joints; Soldering; Temperature; Temperature measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Technology (ISSE), Proceedings of the 2014 37th International Spring Seminar on

Conference_Location

Dresden

Type

conf

DOI

10.1109/ISSE.2014.6887582

Filename

6887582