Title :
Influence of reflow soldering profiles on creation of IMC at the interface of SnBi/Cu
Author :
Hirman, Martin ; Rendl, Karel ; Steiner, Frantisek ; Wirth, Vaclav
Author_Institution :
Dept. of Technol. & Meas., Univ. of West Bohemia, Pilsen, Czech Republic
Abstract :
The paper describes the effect of the solder profile on the formation of an intermetallic layer in the solder composition of 57.6% Bi-42% Sn-0.4% Ag. Soldered joints were made by soldering of chip resistors of 1206 size with different soldering reflow profiles. Solder pads on the PCB are made of copper therefore they mainly make Cu6Sn5 IMC. This layer has an effect on the mechanical strength of the soldered joint. Samples are measured by using the shear strength test. The thickness of the IMC layer is measured by Confocal Laser Scanning Microscope. IMC layer thickness grows with greater delivered energy into the joint during soldering.
Keywords :
bismuth alloys; copper alloys; printed circuits; reflow soldering; shear strength; tin alloys; BiSnAg; Cu6Sn5; IMC; PCB; SnBi-Cu; chip resistors; confocal laser scanning microscope; intermetallic compound; mechanical strength; printed circuit boards; reflow soldering profiles; shear strength test; solder pads; Heating; Intermetallic; Joints; Soldering; Temperature; Temperature measurement;
Conference_Titel :
Electronics Technology (ISSE), Proceedings of the 2014 37th International Spring Seminar on
Conference_Location :
Dresden
DOI :
10.1109/ISSE.2014.6887582
