Title :
Soldering profile optimization for through-hole and surface mounted ceramic capacitors
Author :
Jano, Rajmond ; Fodor, Alexandra
Author_Institution :
Appl. Electron. Dept., Tech. Univ. of Cluj-Napoca, Cluj-Napoca, Romania
Abstract :
The paper examines the feasibility of using vapour phase or infrared reflow soldering technologies for multi-layer ceramic chip (MLCC) and disk ceramic capacitors by employing the pin-in-paste technology. During practical experiments recommendations are made for optimizing the thermal profiles used when soldering there types of components in order to minimize the drift in the capacitance and ESR values of these types of capacitors.
Keywords :
ceramic capacitors; reflow soldering; surface mount technology; disk ceramic capacitor; infrared reflow soldering technology; multilayer ceramic chip; pin-in-paste technology; soldering profile optimization; surface mounted ceramic capacitors; through hole ceramic capacitors; vapour phase soldering technology; Capacitance; Capacitors; Ceramics; Cooling; Soldering; Stress; Temperature measurement;
Conference_Titel :
Electronics Technology (ISSE), Proceedings of the 2014 37th International Spring Seminar on
Conference_Location :
Dresden
DOI :
10.1109/ISSE.2014.6887586
