Title :
Impact of solder paste drying on the solderability
Author :
Otahal, A. ; Adamek, M. ; Szendiuch, I.
Author_Institution :
Dept. of Microelectron., Brno Univ. of Technol., Brno, Czech Republic
Abstract :
This paper deals with the influence of the dried no-clean SAC305 solder paste on the spreading factor. Drying was defined by time between stencil printing and reflow soldering. Main investigated parameter was spreading, which is percentage difference between diameter of circle of solder paste after printing and diameter of circle after soldering.
Keywords :
copper alloys; drying; reflow soldering; silver alloys; solders; tin alloys; SnAgCu; dried no-clean SAC305 solder paste; reflow soldering; solder paste drying; solderability; spreading factor; stencil printing; Atmosphere; Materials; Printing; Seminars; Soldering; Springs; Surface finishing;
Conference_Titel :
Electronics Technology (ISSE), Proceedings of the 2014 37th International Spring Seminar on
Conference_Location :
Dresden
DOI :
10.1109/ISSE.2014.6887592
