Title :
Influence of different methods of ageing on microstructure of solder joints
Author :
Pietrikova, Alena ; Durisin, J. ; Bazu, M. ; Ilian, V.
Author_Institution :
Dept. of Technol. in Electron., Tech. Univ. of Kosice, Kosice, Slovakia
Abstract :
An influence of damping heat and thermal cycling on microstructure and microhardness of solder joints was investigated. Solder joints were prepared by vapour phase and hot air reflow soldering. Results of the microstructure analysis show on significant influence of the ageing on propagation of voids and cracks in the bulk of solder joints.
Keywords :
ageing; microcracks; microhardness; reflow soldering; damping heat; hot air reflow soldering; solder joint ageing; solder joint microhardness; solder joint microstructure; thermal cycling; vapour phase soldering; Aging; DH-HEMTs; Heating; Joints; Merging; Microstructure; Soldering;
Conference_Titel :
Electronics Technology (ISSE), Proceedings of the 2014 37th International Spring Seminar on
Conference_Location :
Dresden
DOI :
10.1109/ISSE.2014.6887593
